工作内容
1、Proficient or familiar:a.Solid state Laser chip or PKG processb.Vertical chip processc.Flip chip processd.High voltage chip process At last one of the above items is proficient
2.New materials(including raw materialI、material of ITO、DBR、pad、passivation...)Developing
3.Chip design(layerout of full device、structure of pad、DBR...)
4.Yield improvement;